Thermal investigation of power diodes in novel integrated disc type packages

Abstract

Abstract Paper focusses on electro-thermal numerical investigation of a novel disc type package for power diodes integrated with microchannel cooling system. Although the new solution ensures much lower average temperature of an electronic element, it results in much higher temperature non-uniformity obtained within the silicon structure. The distribution can be improved with the aid of redesigned microchannel cooler. The maximum junction temperature reduction of more than 25 °C is possible.