Mechanical and electronic properties of Ag3Sn intermetallic compound in lead free solders using ab initio atomistic calculation
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference52 articles.
1. Interfacial reactions between lead-free solders and common base materials
2. Lead-free Solders in Microelectronics
3. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
4. Interfacial reaction and elemental redistribution in Sn3.0Ag0.5Cu–xPd/immersion Au/electroless Ni solder joints after aging
5. Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder
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