Application of tungsten slurry for copper-chemical mechanical polishing
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference9 articles.
1. Chemical‐Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects
2. Role of oxidizer in the chemical mechanical planarization of the Ti/TiN barrier layer
3. Copper metallization for ULSL and beyond
4. Surface Chemistry Studies of Copper Chemical Mechanical Planarization
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