Correlation between process parameters and electrochemical surface state for electrochemical-mechanical polishing application of copper in acid- and alkali-based electrolyte-Reference-Cited by-同舟云学术

Correlation between process parameters and electrochemical surface state for electrochemical-mechanical polishing application of copper in acid- and alkali-based electrolyte

Published:2012-02 Issue:1 Volume:8 Page:81-85
ISSN:1738-8090
Container-title:Electronic Materials Letters
language:en
Short-container-title:Electron. Mater. Lett.

Author:

Lee Youngkyun,Seo Yong-Jin,Yang Jun-Won,Kim Hyung-Ho,Park Yeongbong,Jeong Haedo

Publisher

Springer Science and Business Media LLC

Subject

Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s13391-011-1000-3.pdf

Reference18 articles.

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