Plate-like cell growth during directional solidification of a Zn–20wt%Sn high-temperature lead-free solder alloy
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference32 articles.
1. High-temperature lead-free solders: Properties and possibilities
2. Microstructure and mechanical properties of Sn–Bi, Sn–Ag and Sn–Zn lead-free solder alloys
3. Electronics Without Lead
4. Experimental investigation of the effect of solidification processing parameters on the rod spacings in the Sn–1.2wt.% Cu alloy
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2. Microstructure, electrochemical and mechanical properties of novel Zn–Sn–Cu–Ni high-temperature solder containing a small amount of Al;Journal of Materials Science: Materials in Electronics;2023-08
3. Proposition of a Growth Law as a Function of Solidification Parameters for Monotectic Alloy Systems;High Entropy Materials - Microstructures and Properties;2023-01-18
4. STUDY OF THE STRUCTURE AND PROPERTIES OF LEAD-FREE RAPIDLY SOLIDIFIED ZINC-BASED ALLOYS DURING A HEAT TREATMENT;Physical and Chemical Aspects of the Study of Clusters, Nanostructures and Nanomaterials;2021-12-23
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