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Effective heat dissipation and geometric optimization in an LED module with aluminum nitride (AlN) insulation plate

  • Published:2015-02 Issue: Volume:76 Page:212-219
  • ISSN:1359-4311
  • Container-title:Applied Thermal Engineering
  • language:en
  • Short-container-title:Applied Thermal Engineering

Author:

Jeong Min Woo,Jeon Seung Won,Lee Sang Hun,Kim Yongchan

Funder

NRF

Korea Institute of Energy Technology Evaluation and Planning

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference39 articles.

1. Thermal and luminous investigations of a pc LED based refrigerating liquid prototype;Colombo;Appl. Therm. Eng.,2014

2. On the thermal characterization of an RGB LED-based white light module;Cheng;Appl. Therm. Eng.,2012

3. Thermal spreading resistance characteristics of a high power light emitting diode module;Yang;Appl. Therm. Eng.,2014

4. High power LED arrays special requirements on packaging technology;Kückmann;Proc. Int. Soc. Opt. Eng.,2006

5. A study on the heat dissipation of high power multi-chip COB LEDs;Wu;Microelectron. J.,2012

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