Thermal spreading resistance characteristics of a high power light emitting diode module-Reference-Cited by-同舟云学术

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Thermal spreading resistance characteristics of a high power light emitting diode module

Published:2014-09 Issue:1 Volume:70 Page:361-368
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Yang Kai-Shing,Chung Chi-Hung,Tu Cheng-Wei,Wong Cheng-Chou,Yang Tsung-Yi,Lee Ming-Tsang

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Energy Engineering and Power Technology

Reference43 articles.

1. A study on the heat dissipation of high power multi-chip COB LEDs;Wu;Microelectron. J.,2012

2. Thermal measurements and analyses of low-cost high-power LED packages and their modules;Tsai;Microelectron. Reliab.,2012

3. History, development, and applications of high-brightness visible light-emitting diodes;Dupuis;J. Lightwave Technol.,2008

4. Degradation mechanisms of high-power white LEDs activated by current and temperature;Dal Lago;Microelectron. Reliab.,2011

5. Failure modes and effects analysis for high-power GaN-based light-emitting diodes package technology;Horng;Microelectron. Reliab.,2012

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