Author:
Tang Zhiguo,Liu Qingqing,Li Hai,Min Xiaoteng
Funder
Chinese National Key Technology R&D Program
Hefei Program of Independent Innovation Policy
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference29 articles.
1. Thermal modeling of diamond-based power electronics packaging;Fabis;IEEE Semicond. Therm. Measure. Manage. Symp.,1999
2. S. Lee, M. Early, M. Pellilo, Thermal interface material performance in microelectronics packaging applications, Microelectron. J 28(1) (1997) xiii–xx.
3. Experimental study on cooling technology for high power LED lighting systems by using flat plate heat pipe;Hao;J. Eng. Thermophys.,2010
4. Thermoelectric cooler application in electronic cooling;Chein;Appl. Therm. Eng.,2004
5. Micromachined jets for liquid impingement cooling of VLSI chips;Wang;J. Microelectromech. Syst.,2004
Cited by
28 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献