Thermal interface material performance in microelectronics packaging applications-Reference-Cited by-同舟云学术

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Thermal interface material performance in microelectronics packaging applications

Published:1997-01 Issue:1 Volume:28 Page:xiii-xx
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Lee Seri,Early Malcolm,Pellilo Mark

Publisher

Elsevier BV

Subject

General Engineering

Reference1 articles.

1. New Contact and Gap Correlations for Conforming Rough Surfaces;Yovanovich,1981

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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