Determination of temperature distribution in three-dimensional integrated circuits (3D ICs) with unequally-sized die
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Energy Engineering and Power Technology
Reference38 articles.
1. 3-D ICs: a novel chip design for improving deep submicron interconnect performance and systems-on-chip integration;Banerjee;Proc. IEEE,2001
2. Three-dimensional integrated circuits and the future of system-on-chip designs;Patti;Proc. IEEE,2006
3. S. Pozder, R. Chatterjee, A. Jain, Z. Huang, R.E. Jones, E. Acosta, Progress of 3D integration technologies and 3D interconnects, in: Proc. IEEE Intl. Interconnect Tech. Conf., 2007, pp. 213–215.
4. New design considerations for cost effective three-dimensional (3D) system integration;Alam;IEEE Trans. VLSI Syst.,2010
5. S.M. Alam, R.E. Jones, S. Pozder, A. Jain, Die/wafer stacking with reciprocal design symmetry (RDS) for mask reuse in three-dimensional (3D) integration technology, in: Proc. IEEE Intern. Symp. Quality Electron. Design, 2009, pp. 569–575.
Cited by 25 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Double-sided numerical thermal modeling of fan-out panel-level MOSFET power modules;Case Studies in Thermal Engineering;2023-12
2. Heat transfer in a vertically integrated semiconductor device with unequal layer widths;International Journal of Heat and Mass Transfer;2023-12
3. Transient temperature distribution in a multilayer semiconductor device with dynamic thermal load and non-uniform thermal contact resistance between layers;International Journal of Heat and Mass Transfer;2023-11
4. Optimizing Heat Source Arrangement for 3D ICs with irregular structures using machine learning methods;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
5. Thermal modeling and analysis of 3-D integrated circuits with irregular structure;Thermal Science;2023
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3