Effect of aging on the growth of intermetallic compounds at the interface of Sn–9Zn–xAg/Cu substrates-Reference-Cited by-同舟云学术

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Effect of aging on the growth of intermetallic compounds at the interface of Sn–9Zn–xAg/Cu substrates

Published:2003-03 Issue:1-2 Volume:250 Page:236-243
ISSN:0022-0248
Container-title:Journal of Crystal Growth
language:en
Short-container-title:Journal of Crystal Growth

Author:

Chang Tao-Chih,Wang Moo-Chin,Hon Min-Hsiung

Publisher

Elsevier BV

Subject

Materials Chemistry,Inorganic Chemistry,Condensed Matter Physics

Reference14 articles.

1. The role of intermetallic compounds in lead‐free soldering

2. Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu

3. Microstructure and shear strength evolution of SnAg/Cu surface mount solder joint during aging

4. Microstructure and adhesion properties of Sn–0.7Cu/Cu solder joints

Cited by 26 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Interfacial Reactions in the Ni/Sn-xZn/Cu Sandwich Couples;Journal of Electronic Materials;2015-12-01

2. Sn-Zn/Ni-Co Interfacial Reactions at 250°C;Journal of Electronic Materials;2014-05-28

3. Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys;Journal of Alloys and Compounds;2014-01

4. Evolution of Different Types of Interfacial Structures;Interfacial Compatibility in Microelectronics;2012

5. Growth Kinetics of Intermetallic Compounds at the Interface of Liquid Sn-9Zn/Cu;Advanced Materials Research;2011-05

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