Author:
Laurila Tomi,Vuorinen Vesa,Mattila Toni T.,Turunen Markus,Paulasto-Kröckel Mervi,Kivilahti Jorma K.
Reference170 articles.
1. T. Uno, K. Tatsumi, Y. Ohno, Void formation and reliability in gold–aluminum bonding. Proc. ASME/JSME Adv. Electr. Pack. EEP 1(2), 771–777 (1992)
2. T. Uno, K. Tatsumi, Thermal reliability of gold–aluminum bonds encapsulated in bi-phenyl epoxy resin. Microelectron. Reliab. 40, 145–153 (2000)
3. F. Wulff, C.W. Tok, C.D. Breach, Oxidation of Au4Al in gold ballbonds. Mater. Lett. 61, 452–456 (2007)
4. M.-H. Lue, C.-T. Huang, S.-T. Huang, K.-C. Hsieh, Bromine-and chlorine-induced degradation of gold–aluminum bonds. J. Electron. Mater. 33(10), 1111–1117 (2004)
5. S.-A. Gam, H.-J. Kim, J.-S. Cho, Y.-J. Park, J.-T. Moon, K.-W. Paik, Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability. J. Electron. Mater. 35(11), 2048–2055 (2006)