Bromine- and chlorine-induced degradation of gold-aluminum bonds-Reference-Cited by-同舟云学术

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Bromine- and chlorine-induced degradation of gold-aluminum bonds

Published:2004-10 Issue:10 Volume:33 Page:1111-1117
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Lue Min-Hsien,Huang Chen-Town,Huang Sheng-Tzung,Hsieh Ker-Chang

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-004-0112-z.pdf

Reference10 articles.

1. E. Philofsky, Proc. IEEE Reliability Physics Symp. (New York: IEEE, 1970), pp. 177–185.

2. T. Uno, K. Tatsumi, and Y. Ohno, Proc. Joint ASME/JSME Advanced Electronic Packaging (Englewood, CO: Rogers Pub., 1992), pp. 771–777.

3. H.-S. Chang, K.-C. Hsieh, T. Martens, and A. Yang, IEEE Trans. Components Packaging Technol. 27, 155 (2004).

4. T. Uno and K. Tatsumi, Microelectron. Reliab. 40, 145 (2000).

5. E. Imasato, M. Araki, I. Shimizu, and Y. Ohno, IEEE/CPMT Electronic Packaging Technology Conf. (Piscataway, NJ: IEEE, 1998), pp. 338–344.

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