Multi-wire sawing of sapphire crystals with reciprocating motion of electroplated diamond wires-Reference-Cited by-同舟云学术

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Multi-wire sawing of sapphire crystals with reciprocating motion of electroplated diamond wires

Published:2013 Issue:1 Volume:62 Page:335-338
ISSN:0007-8506
Container-title:CIRP Annals
language:en
Short-container-title:CIRP Annals

Author:

Kim Hyoungjae,Kim Doyeon,Kim Chulmin,Jeong Haedo

Funder

Ministry of Knowledge and Economy of Korea

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference9 articles.

1. Modern Trends in Crystal Growth and New Applications of Sapphire;Akselrod;Journal of Crystal Growth,2012

2. Nitride-Based Semiconductors for Blue and Green Light-Emitting Devices;Ponce;Nature,1997

3. High-Brightness InGaN Blue, Green and Yellow Light-Emitting Diodes with Quantum Well Structures;Nakamura;Japanese Journal of Applied Physics,1995

4. Fixed Abrasive Diamond Wire Saw Slicing of Single-Crystal Cilicon Carbide Wafers;Hardin;Materials and Manufacturing Processes,2004

5. Characterization of Polycrystalline Silicon Wafers for Solar Cells Sliced with Novel Fixed-Abrasive Wire;Watanabe;Progress in Photovoltaics: Research and Applications,2010

Cited by 36 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Efficient manufacture of high-performance electroplated diamond wires utilizing Cr-coated diamond micro-powder;Materials Science in Semiconductor Processing;2024-08

2. Mechanical model of diamond wire sawing for curved surfaces;International Journal of Mechanical Sciences;2024-08

3. Wire Bow In Situ Measurement for Monitoring the Evolution of Sawing Capability of Diamond Wire Saw during Slicing Sapphire;Materials;2024-05-02

4. Experimental study on the formation mechanism of saw marks in wire sawing;International Journal of Mechanical Sciences;2024-03

5. Dynamic model and machining mechanism of wire sawing;Journal of Materials Processing Technology;2023-01

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