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Dynamic model and machining mechanism of wire sawing

  • Published:2023-01 Issue: Volume:311 Page:117820
  • ISSN:0924-0136
  • Container-title:Journal of Materials Processing Technology
  • language:en
  • Short-container-title:Journal of Materials Processing Technology

Author:

Lai Zhiyuan,Huang Hui,Hu Zhongwei,Liao Xinjiang

Funder

National Natural Science Foundation of China

Changjiang Scholar Program of Chinese Ministry of Education

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference27 articles.

1. Framework for investigating wire saw rock cutting;Ahn;Int. J. Mach. Tools Manuf.,2020

2. Comparative analysis of mechanical strength of diamond-sawn silicon wafers depending on saw mark orientation, crystalline nature and thickness;Carton;Sol. Energ. Mat. Sol. C.,2019

3. Modeling and analysis of wire motion during rocking mode diamond wire sawing of mono-crystalline alumina oxide wafer;Chen;Int. J. Adv. Manuf. Technol.,2018

4. Study on the subsurface microcrack damage depth in electroplated diamond wire saw slicing SiC crystal;Gao;Ceram. Int.,2018

5. Material removal and surface generation mechanisms in diamond wire sawing of silicon crystal;Gao;Mat. Sci. Semicon. Proc.,2019

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