Comparative analysis of mechanical strength of diamond-sawn silicon wafers depending on saw mark orientation, crystalline nature and thickness

Author:

Carton Louise,Riva Roland,Nelias Daniel,Fourmeau Marion,Coustier Fabrice,Chabli Amal

Funder

Agence de l'Environnement et de la Maîtrise de l'Energie

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

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