Author:
Wang W.,Liu Z.X.,Zhang W.,Huang Y.H.,Allen D.M.
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Reference8 articles.
1. Development of a High-Speed Manufacturing Method for Electroplated Diamond Wire Tools;Chiba;Ann. CIRP,2003
2. Surface Texture Analysis of Fixed and Free Abrasive Machining of Silicon Substrates for Solar Cells;Chen;Adv. Mater. Res.,2010
3. Investigation of Silicon Wafering by Wire EDM;Luo;J. Mater. Sci.,1992
4. Study of Electrical Discharge Machining Technology for Slicing Silicon Ingots;Peng;J. Mater. Proc. Technol.,2003
5. A New Slicing Method of Monocrystalline Silicon Ingot by Wire EDM;Okada,1998
Cited by
39 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献