Prediction of polishing pressure distribution in CMP process with airbag type wafer carrier
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering
Reference12 articles.
1. The Theory and Design of Plate Glass Polishing Machines;Preston;Journal of the Society of Glass Technology,1927
2. Mechanisms of the CMP Process in Integrated Circuit Fabrication;Saka;CIRP Annals,2001
3. Multi-Sensor Monitoring System in CMP for Correlations with Process Issues;Jeong;CIRP Annals,2006
4. Qualitative Prediction of SiO2 Removal Rates During Chemical Mechanical Polishing;Castillo-Mejia;Journal of Electrochemical Society,2000
5. Influence of Wafer Edge Geometry on Removal Rate Profile in Chemical Mechanical Polishing;Fukuda;Japanese Journal of Applied Physics,2012
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