Determination of internal stress in soldered joints with Sn-based alloys by X-ray diffraction
Author:
Publisher
Elsevier BV
Subject
General Medicine
Reference18 articles.
1. Lead-free Solders in Microelectronics
2. Tensile properties and microstructural characterization of Sn–0.7Cu–0.4Co bulk solder alloy for electronics applications
3. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
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5. Real-time SEM/FIB studies of whisker growth and surface modification
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Deformation behavior and mechanical properties of rolled carbon fiber reinforced Al-matrix composites via protection with Sn layer;Journal of Materials Processing Technology;2023-06
2. Study on Soldering Alloy Structure Influence on Whiskers Germination and Grow Process in Joints Executed Using Tin Base Soldering Alloys;Defect and Diffusion Forum;2022-05-27
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