Recent developments in code compression techniques for embedded systems-Reference-Cited by-同舟云学术

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Recent developments in code compression techniques for embedded systems

Published:2021 Issue: Volume:46 Page:4128-4132
ISSN:2214-7853
Container-title:Materials Today: Proceedings
language:en
Short-container-title:Materials Today: Proceedings

Author:

Prasad Dumpa,Rahul Reddy P.,Sreelatha B.,Jeevan Reddy Koya,Jayabalan Sudharsan,Kumar Panigrahy Asisa

Publisher

Elsevier BV

Subject

General Medicine

Reference17 articles.

1. Shiv Govind Singh, and Siva Rama Krishna Vanjari. “Ultra-thin Ti passivation mediated breakthrough in high quality Cu-Cu bonding at low temperature and pressure.”;Panigrahi;Materials Letters,2016

2. Low temperature Cu–Cu bonding technology in three-dimensional integration: An extensive review;Panigrahy;Journal of Electronic Packaging,2018

3. Demonstration of sub 150° C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer;Panigrahi;Materials Letters,2017

4. Oxidation Resistive, CMOS Compatible Copper-Based Alloy Ultrathin Films as a Superior Passivation Mechanism for Achieving 150 C Cu–Cu Wafer on Wafer Thermocompression Bonding;Panigrahi;IEEE Transactions on Electron Devices,2017

5. Surface density gradient engineering precedes enhanced diffusion; drives CMOS in-line process flow compatible Cu–Cu thermocompression bonding at 75° C;Panigrahy;IEEE Transactions on Device and Materials Reliability,2019

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Machine Learning-Based Collection and Analysis of Embedded Systems Vulnerabilities;Advances in Systems Analysis, Software Engineering, and High Performance Computing;2023-12-29

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