The formation of Ti x N y and Ta x N y -based diffusion barriers
Author:
Publisher
Elsevier BV
Subject
General Medicine
Reference25 articles.
1. Reactively sputtered TiN as a diffusion barrier between Cu and Si
2. J.D. Plummer, M.D. Deal, P.B. Griffin, Silicon VLSI Technology, 2000.
3. Atomic layer deposition of metal and nitride thin films: Current research efforts and applications for semiconductor device processing
4. The evolution of diffusion barriers in copper metallization
5. Calculation of the concentration profile of copper in the TiN/CoSi2/Si system during thermal heating
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