The conduction of heat from sliding solids-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

The conduction of heat from sliding solids

Published:1970-05 Issue:5 Volume:13 Page:857-869
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Barber J.R

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference21 articles.

1. The area of contact between rough surfaces and flats;Greenwood;Trans. A.S.M.E. Ser.F,1967

2. Friction between unlubricated metals— a theoretical analysis of the junction model;Green,1955

3. The properties of model friction junctions;Greenwood,1957

4. A model junction study of severe metallic wear;Brockley;Wear,1965

5. The Conduction of Heat in Solids;Carslaw,1959

Cited by 81 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of scanning strategy on the thermo-structural coupling field and cracking behavior during laser powder bed fusion of Ti48Al2Cr2Nb alloys;Materials Today Communications;2024-12

2. Analytical Solution for Transient Thermal Behavior of Two Semisolids With Contact Resistance and Interfacial Heat Generation;ASME Journal of Heat and Mass Transfer;2024-07-16

3. Functional Material Gradients and Targeted Tribological Function of Locomotor Assemblies;Advances in Chemical and Materials Engineering;2024-02-02

4. Features of the Application of Friction Braking in High-Speed Track Tests;E3S Web of Conferences;2023

5. Friction Reduction Due to Heating in the Sliding Contact of Smart Coating: Modeling of Mutual Effect;Lubricants;2022-07-20

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3