Analytical Solution for Transient Thermal Behavior of Two Semisolids With Contact Resistance and Interfacial Heat Generation
Author:
Affiliation:
1. Department of Mathematics and Statistics, Air Force Institute of Technology, Wright-Patterson Air Force Base , OH 45433
2. Department of Aeronautics and Astronautics, Air Force Institute of Technology, Wright-Patterson Air Force Base , OH 45433
Abstract
Publisher
ASME International
Link
https://asmedigitalcollection.asme.org/heattransfer/article-pdf/146/11/114501/7353895/ht_146_11_114501.pdf
Reference11 articles.
1. The Role of Thermal Effusivity on the Incipient Growth of the Surface Temperature in a Semi-Infinite Region Absorbing Heat Flux at the Surface;Therm. Sci. Eng.,2023
2. Thermal Contact Resistance at Rough Ceramic-Metallic Joints;J. Thermophys. Heat Transfer,2019
3. Reducing Thermal Contact Resistance for Rigid-Insulation Thermal Measurements;J. Thermophys. Heat Transfer,2012
4. Modeling Thermal Contact Resistance: A Scale Analysis Approach;ASME J. Heat Transfer-Trans. ASME,2004
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