Effect of laminating parameters on the adhesion property of flexible copper clad laminate with adhesive layer
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference15 articles.
1. Adhesion energy of Cu/polyimide interface in flexible printed circuits
2. Characterization of sputtered nichrome (Ni–Cr 80/20 wt.%) films for strain gauge applications
3. The mechanical behaviour of polyimide-copper laminates
4. Interfacial fracture energy measurements in the Cu/Cr/polyimide system
5. Atmospheric silent discharge versus low-pressure plasma treatment of polyethylene, polypropylene, polyisobutylene, and polystyrene
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