Evaluation of Electrolytically Manufactured Copper Foils Properties-Reference-Cited by-同舟云学术

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Evaluation of Electrolytically Manufactured Copper Foils Properties

Published:2023-05-10 Issue: Volume: Page:
ISSN:
Container-title:2023 46th International Spring Seminar on Electronics Technology (ISSE)
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Author:

Dušek Karel¹,Veselý Petr¹,Sedláček Josef¹,Vigner Vojtěch¹,Hrzina Pavel¹,Bartošová Kateřina¹,Minář Jaroslav¹,Neruda Marek²,Vojtěch Lukáš²

Affiliation:

1. Czech Technical University in Prague,Faculty of Electrical Engineering,Department of Electrotechnology, Technická 2,Prague 6,Czech Republic,160 00

2. Czech Technical University in Prague,Faculty of Electrical Engineering,Department of Telecommunication Engineering, Technická 2,Prague 6,Czech Republic,160 00

Funder

Technology Agency of the Czech Republic

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10168303/10168312/10168520.pdf?arnumber=10168520

Reference10 articles.

1. Improvement of performance stability of electrolytic copper foils by bi-component additives

2. Effect of laminating parameters on the adhesion property of flexible copper clad laminate with adhesive layer

3. Crystal Growth of Electrolytic Cu Foil

4. Mechanical properties and microstructure of rolled and electrodeposited thin copper foil

5. On monitoring mechanical characteristics of rolled electrolytic copper

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