Balancing dielectric properties and dimensional stability of poly(amide-imide) films via introducing a micro-crosslinked structure

Author:

Peng Yuhan,Zha Daoxin,Yin Yuanyuan,Zeng Shaohua,Chen Pengpeng

Publisher

Elsevier BV

Reference36 articles.

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2. Novel poly(benzoxazole-etherimide) copolymer for two-layer flexible copper-clad laminate;Zhuang;J. Macromol. Sci. Part B Phys.,2012

3. Residual interfacial deformation in flexible copper clad laminate occurring during roll-to-roll composite film manufacturing;Lee;Int. J. Precis. Eng. Manuf. Green. Technol.,2021

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5. Preparation and properties of ODPA-ODA-SDA polyimide film and its application in corona resistance;Lang;Prog. Org. Coat.,2022

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