Author:
He Jiangbo,Zhou Wu,He Xiaoping,Yu Huijun,Peng Peng,Wang Shuang
Funder
National Natural Science Foundation of China
National Key Research and Development Plan
Key scientific research fund of Xihua University
Subject
Polymers and Plastics,General Chemical Engineering,Biomaterials
Reference20 articles.
1. Effect of die-bonding process on MEMS device;Song;J Microelectromech Syst,2009
2. Analytical study and compensation for temperature drifts of a bulk silicon MEMS capacitive accelerometer;He,2016
3. Zwahlen P, Nguyen A M, Dong Y. , et al. Navigation grade MEMS accelerometer, in: MEMS 2010, Hong Kong, China,; 2010. p. 631–634.
4. Melamud R, Hopcroft M, Jha C, Kim B, Chandorkar S, Candler R, Kenny TW. Effects of stress on the temperature coefficient of frequency in double clamped resonators. In: Proceedings of the 13th International Conference on Solid-State Sensors, Actuators and Microsystems, Seoul, Korea; 2005. p. 392–395.
5. Stress analysis of plastic IC package containing various interface delaminations using the boundary element method;Dong;EngFractMech,2008
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献