New Cleaning and Surface Conditioning Techniques and Technologies-Reference-Cited by-同舟云学术

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New Cleaning and Surface Conditioning Techniques and Technologies

Published:2008 Issue: Volume: Page:661-688
ISSN:
Container-title:Handbook of Silicon Wafer Cleaning Technology
language:
Short-container-title:

Author:

Reinhardt Karen A.

Publisher

Elsevier

Reference88 articles.

1. Post etch cleaning of low-k dielectric materials for advanced interconnects: Characterization and process optimization

2. International Technology Roadmap for Semiconductors,2006

3. AZC2;Kittle,2002

4. AZC2;Kittle,2002

5. US Patent 6,418,942;Gray,2002

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Engineering Creativity: The Influence of General Knowledge and Thinking Heuristics;Advances in Systematic Creativity;2018-11-02

2. Front-End Processes;Nanoelectronics;2017-04-07

3. Impact of interstitial oxygen trapped in silicon during plasma growth of silicon oxy-nitride films for silicon solar cell passivation;Journal of Applied Physics;2016-03-07

4. Experimental evidence for an optical interference model for vibrational sum frequency generation on multilayer organic thin film systems. I. Electric dipole approximation;The Journal of Chemical Physics;2015-01-14

5. Application of hydrogenation to low-temperature cleaning of the Si(001) surface in the processes of molecular-beam epitaxy: Investigation by scanning tunneling microscopy, reflected high-energy electron diffraction, and high resolution transmission electron microscopy;Journal of Applied Physics;2012-07

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