Front-End Processes-Reference-Cited by-同舟云学术

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Front-End Processes

Published:2017-04-07 Issue: Volume: Page:265-288
ISSN:
Container-title:Nanoelectronics
language:
Short-container-title:

Author:

Mariani Marcello¹,Possémé Nicolas²

Affiliation:

1. Micron Technology, Inc.; Emerging Memory PI, R&D; Via C. Olivetti 2 20041 Agrate Brianza Italy

2. Commissariat à l'énergie atomique et aux énergies alternatives; Silicon Technologies Division (DTSI/SPAT/LGRA); MINATEC Campus, 17 rue des Martyrs 38054 Grenoble Cedex France

Publisher

Wiley-VCH Verlag GmbH & Co. KGaA

Reference73 articles.

1. Cleaning solutions based on hydrogen peroxide for use in silicon semiconductor technology;Kern;RCA Rev.,1970

2. ITRS 2011

3. New Cleaning and Surface Conditioning Techniques and Technologies

4. Kittle , P. 2002 Photresist removal using aqueous foam 13

5. Particle cleaning technologies to meet advanced semiconductor device process requirements;Okorn-Schmidt;ECS J. Solid State Sci. Technol.,2014

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A low-fabrication-temperature, high-gain chip-scale waveguide amplifier;Science China Information Sciences;2022-05-19

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