Electrical properties and stabilization of sputtered films by inert gas precipitation
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference8 articles.
1. Gas Incorporation into Sputtered Films
2. Gas incorporation in sputtered and evaporated gold films
3. Proc. 4th Int. Vacuum Congr.;Jones,1968
4. Argon Concentration in Tungsten Films Deposited by dc Sputtering
5. Incorporation and behavior of helium in co-deposited films
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1. Auger electron spectroscopy composition depth profiling of Cr/Ni multilayer structures using Ar+ and Xe+ ions;Thin Solid Films;1992-02
2. Ion beam induced roughness and its effect in AES depth profiling of multilayer Ni/Cr thin films;Surface and Interface Analysis;1988-07
3. Dependence of interface widths on ion bombardment conditions in secondary ion mass spectrometric analysis of a nickel/chromium multilayer structure;Analytical Chemistry;1987-06-01
4. Sputter deposition of multilayered structures for use in sputter depth profile calibration;Vacuum;1986-10
5. Characterization of NBS Standard Reference Material 2135 for sputter depth profile analysis;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;1985-05
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