Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. Proc. 10th VMIC Conference;Luther,1993
2. Materials Issues in Copper Interconnections
3. Formation of TiN‐encapsulated copper structures in a NH3ambient
4. Process for fabricating copper interconnects in ultra large scale integrated (ULSI) circuits;Li,1994
5. Self-aligned process for capping copper lines;Li,1994
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