Recent advances in solder bond technology for microelectronic packaging-Reference-Cited by-同舟云学术

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Recent advances in solder bond technology for microelectronic packaging

Published:1980-10 Issue:3 Volume:72 Page:433-442
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Hall P.M.,Morabito J.M.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference39 articles.

1. Controlled collapse reflow chip joining;Miller;IBM J. Res. Dev.,1969

2. Design considerations for a flip chip joining technique;Lin;Solid State Technol.,1970

3. Hybrid IC structures using solder reflow technology;Kamei,1978

4. Hybrid IC structure made by solder reflow technology;Ariyoshi;Rev. Electr. Commun. Lab.,1978

5. A new family of microelectronic packages for avionics;Settle;Solid State Technol.,1978

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of curing agent and curing substrate on low temperature curable silver conductive adhesive;Journal of Materials Science: Materials in Electronics;2019-01-02

2. Package Sealing and Encapsulation;Microelectronics Packaging Handbook;1997

3. The effect of low gold concentrations on the creep of eutectic tin-lead joints;Metallurgical and Materials Transactions A;1994-06

4. Package Sealing and Encapsulation;Microelectronics Packaging Handbook;1989

5. Significant Features of Solder Connections to Gold-Plated Thin Films;IEEE Transactions on Components, Hybrids, and Manufacturing Technology;1982-12

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