登录 注册 会员服务 联系我们

Surface and interface analysis for the development of VLSI devices

  • Published:1989-12 Issue:1-2 Volume:181 Page:17-34
  • ISSN:0040-6090
  • Container-title:Thin Solid Films
  • language:en
  • Short-container-title:Thin Solid Films

Author:

Grasserbauer M

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference68 articles.

1. Manufacturing process technology for MOS VLSI;Voltmer,1981

2. Microstructure Fabrication in Electronic Devices

3. Semiconductor integrated circuit technology;Thomas,1973

4. Material Science, Chemistry and Physics at Small Dimensions;Ruoff,1982

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reliability Physics and Its Multidisciplinary Approach in the Development of Electrical and Electronic Products for Test and Measurement;Handbook of Quality System, Accreditation and Conformity Assessment;2024

2. Reliability Physics and Its Multidisciplinary Approach in the Development of Electrical and Electronic Products for Test and Measurement;Handbook of Quality System, Accreditation and Conformity Assessment;2023-11-28

3. Reliability physics of electronic devices through material characterization and environmental stress testing techniques;Microelectronics Reliability;1994-02

4. Solid state mass spectrometry for materials science;Pure and Applied Chemistry;1992-01-01

5. Elemental trace analysis of surfaces and interfaces: goals, accomplishments and challenges;Philosophical Transactions of the Royal Society of London. Series A: Physical and Engineering Sciences;1990-10-15
同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3