Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. R. E. Hummel, R. T. DeHoff and H. J. Geier, J. Phys. Chem. Solids, submitted for publication.
2. Surface topology changes during electromigration in metallic thin film stripes
3. Electromigration in thin silver, copper, gold, indium, tin, lead and magnesium films
4. Electromigration‐Induced Failures in, and Microstructure and Resistivity of, Sputtered Gold Films
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95 articles.
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