Electromigration‐Induced Failures in, and Microstructure and Resistivity of, Sputtered Gold Films-Reference-Cited by-同舟云学术

Electromigration‐Induced Failures in, and Microstructure and Resistivity of, Sputtered Gold Films

Published:1972-02 Issue:2 Volume:43 Page:307-311
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Blair J. C.,Fuller C. R.,Ghate P. B.,Haywood C. T.

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.1661112

Reference20 articles.

1. Expanded contacts and interconnexions to monolithic silicon integrated circuits

2. Metallization systems for silicon integrated circuits

3. Corrosion Resistance of Several Integrated-Circuit Metallization Systems

4. Electromigration in thin gold films

5. SOME OBSERVATIONS ON THE ELECTROMIGRATION IN ALUMINUM FILMS

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