Die bond materials and bonding mechanisms in microelectronic packaging
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference21 articles.
1. VLSI Technology;Sze,1983
2. Die bonding and package sealing materials;Singer;Semiconduct. Int.,1983
3. Adhesives, Sealants and Coatings for the Electronics Industry;Flick,1986
4. Ceramics Handbook,1965
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