Thermal Stress Considerations in Die-Attachment-Reference-Cited by-同舟云学术

Thermal Stress Considerations in Die-Attachment

Published:1993 Issue: Volume: Page:194-220
ISSN:
Container-title:Thermal Stress and Strain in Microelectronics Packaging
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Author:

Matijasevic Goran S.,Wang Chen Yu,Lee Chin C.

Publisher

Springer US

Link

http://link.springer.com/content/pdf/10.1007/978-1-4684-7767-2_6.pdf

Reference64 articles.

1. Feinstein, L. G., “Die Attachment Methods,” Electronic Materials Handbook, Vol. 1: Packaging,M. L. Minges and C. A. Dostal, eds., ASM International, Materials Park, Ohio, 1989, pp. 213–223.

2. Selvaduray, G. S., “Die Bond Material and Bonding Mechanisms in Microelectronic Packaging,” Thin Solid Films,153, 1987, pp. 431–455.

3. Shukla, R. K., and N. P. Mencinger, “A Critical Review of VLSI Die Attachment in High Reliability Application,” Solid State Technology, 28(7), 1985, pp. 67–74.

4. Van Kessel, C. G. M., S. A. Gee, and J. J. Murphy, “The Quality of Die-Attachment and Its Relationship to Stresses and Vertical Die-Cracking,” IEEE Trans. Components, Hybrids, and Manufacturing Technology, CHMT-6(4), 1984, pp. 414–420.

5. Chiang, S. S., and R. K. Shukla, “Failure Mechanism of Die Cracking Due to Imperfect Die Attachment,” Proc. 34th Electronics Components Conference, IEEE/Electronic Industries Association (EIA), 1984, pp. 195–202.

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