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Integration of chemical-mechanical polishing into CMOS integrated circuit manufacturing

Published:1992-11 Issue:1-2 Volume:220 Page:1-7
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Landis Howard,Burke Peter,Cote William,Hill William,Hoffman Cheryl,Kaanta Carter,Koburger Charles,Lange Walter,Leach Micheal,Luce Stephen

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference48 articles.

1. 20th Conf. on Solid State Devices and Materials;Kotani,1988

2. Proc. 6th VLSI Multilevel Interconnection Conf.;Horn,1989

3. Proc. 6th VLSI Multilevel Interconnection Conf.;Forester,1989

4. Proc. 6th VLSI Multilevel Interconnection Conf.;Marks,1989

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