Comparative study of the lubricating behavior between 12-in. copper disk and wafer during chemical mechanical polishing-Reference-Cited by-同舟云学术

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Comparative study of the lubricating behavior between 12-in. copper disk and wafer during chemical mechanical polishing

Published:2017-01 Issue: Volume:105 Page:37-41
ISSN:0301-679X
Container-title:Tribology International
language:en
Short-container-title:Tribology International

Author:

Zhao Dewen,He Yongyong,Wang Tongqing,Lu Xinchun

Funder

Natural Science Foundation of China

Science Fund for Creative Research Groups

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanical Engineering,Mechanics of Materials

Reference15 articles.

1. Present and future role of chemical mechanical polishing in wafer bonding;Gui;J Electrochem Soc,1998

2. Chemical mechanical polishing: theory and experiment;Zhao;Friction,2013

3. Fluid pressure and its effects on chemical mechanical polishing;Zhou;Wear,2002

4. Fluid pressures and pad topography in chemical mechanical polishing;Borucki;J Electrochem Soc,2005

5. In situ measurement of fluid pressure at the wafer-pad interface during chemical mechanical polishing of 12-inch wafer;Zhao;J Electrochem Soc,2011

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1. Nanoscale tribological aspects of chemical mechanical polishing: A review;Applied Surface Science Advances;2022-10

2. Pad-Wafer-Slurry Interface Information from Force Data;ECS Journal of Solid State Science and Technology;2019

3. Perspective—Electrochemical Assessment of Slurry Formulations for Chemical Mechanical Planarization of Metals: Trends, Benefits and Challenges;ECS Journal of Solid State Science and Technology;2018

4. Analysis of magnetorheological fluid behavior in chemo-mechanical magnetorheological finishing (CMMRF) process;Precision Engineering;2017-07

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