Modeling and experimental investigation of monocrystalline silicon wafer cut by diamond wire saw-Reference-Cited by-同舟云学术

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Modeling and experimental investigation of monocrystalline silicon wafer cut by diamond wire saw

Published:2023-02 Issue: Volume:278 Page:109029
ISSN:0013-7944
Container-title:Engineering Fracture Mechanics
language:en
Short-container-title:Engineering Fracture Mechanics

Author:

Wang Yan,Huang Shengju,Qian Zhaofeng,Su Jinhuan,Du Lin

Funder

Natural Science Foundation of Shanghai

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference22 articles.

1. Fracture strength of silicon wafers sawn by fixed diamond wire saw;Liu;Sol Energy,2017

2. Effect of cutting parameters on surface integrity of monocrystalline silicon sawn with an endless diamond wire saw;Costa;Sol Energy,2020

3. Effect of crystal defects on mechanical properties relevant to cutting of multicrystalline solar silicon;Wu;Mater Sci Semicond Process,2013

4. Research on the machinability of A-plane sapphire under diamond wire sawing in different sawing directions;Wang;Ceram Int,2019

5. Integrated Process for Silicon Wafer Thinning;Zhou;IEEE,2011

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1. Fractal analysis on the surface topography of Monocrystalline silicon wafers sawn by diamond wire;Materials Science in Semiconductor Processing;2024-09

2. A critical review on the fracture of ultra-thin photovoltaics silicon wafers;Solar Energy Materials and Solar Cells;2024-08

3. A novel development of a new single switch inductor coupled DC-DC converter for PV system with two-leg inverter;Scientific Reports;2024-05-10

4. Wire Bow In Situ Measurement for Monitoring the Evolution of Sawing Capability of Diamond Wire Saw during Slicing Sapphire;Materials;2024-05-02

5. Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon;Micromachines;2023-07-27

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