An analytical model for thermoelastic crack problems in a strip incorporating convective heat transfer between lateral surfaces and ambient environment-Reference-Cited by-同舟云学术

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An analytical model for thermoelastic crack problems in a strip incorporating convective heat transfer between lateral surfaces and ambient environment

Published:2024-01 Issue: Volume:295 Page:109810
ISSN:0013-7944
Container-title:Engineering Fracture Mechanics
language:en
Short-container-title:Engineering Fracture Mechanics

Author:

Zhang Aibing,Lou Jia,Wang Baolin,Huang Wei Min

Funder

Natural Science Foundation of Zhejiang Province

Natural Science Foundation of Ningbo Municipality

China Scholarship Council

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference31 articles.

1. On some crack problems in anisotropic thermoelasticity;Atkinson;Int J Solids Struct,1977

2. The linear thermoelastic problem of uniform heat flow disturbed by a two-dimensional crack in a strip;Konishi;Int J Eng Sci,1973

3. Thermoelastic fracture mechanics for nonhomogeneous material subjected to unsteady thermal load;Wang;J Appl Mech,2000

4. Thermal and mechanical analysis of delamination in GaN-based light-emitting diode packages;Hu;J Cryst Growth,2006

5. A review of the performance and characterization of conventional and promising thermal interface materials for electronic package applications;Swamy;J Electron Mater,2019

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