A Review of the Performance and Characterization of Conventional and Promising Thermal Interface Materials for Electronic Package Applications-Reference-Cited by-同舟云学术

A Review of the Performance and Characterization of Conventional and Promising Thermal Interface Materials for Electronic Package Applications

Published:2019-09-18 Issue:12 Volume:48 Page:7623-7634
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Swamy M. C. Kumar,Satyanarayan ^ORCID

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-019-07623-7.pdf

Reference125 articles.

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5. T.Y. Lim, and M. Velderrain, 9th IEEE Electronics Packaging Technology Conference (EPTC) proceedings, (2007), pp. 914–916.

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