Abstract
Abstract
The thermal management in high-performance electronic devices demands the enhanced rate of heat dissipation for controlling operational temperatures and achieving optimal functioning. There are many interfaces in the heat dissipation circuit where thermal interface materials are applied to enhance heat transfer rate. An experimental investigation is presented on metallic contacts to study the interfacial heat transfer with and without a thermal interface material. Thermal contact conductance is known to be an important parameter estimated for the analysis of interfacial heat transfer across the thermal contacts. Therefore, the thermal contact conductance has been evaluated to identify an effective thermal interface material suitable for the present range of contact pressure and heat flux conditions. Silicone grease is a widely used thermal interface material in electronic industry. Thus, commercially available Silicone grease is evaluated in different boundary line thicknesses for a range of contact pressure and mean interface temperatures. Further, a novel composite thermal paste has been prepared by mixing cupric oxide nanopowder and Silicone grease in three different mass concentrations. Eventually, the results for the new thermal paste showed improved thermal contact conductance and lower interfacial temperature drops as compared to Silicone grease for similar test conditions with few limitations.