Thermal and mechanical analysis of delamination in GaN-based light-emitting diode packages-Reference-Cited by-同舟云学术

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Thermal and mechanical analysis of delamination in GaN-based light-emitting diode packages

Published:2006-02 Issue:1 Volume:288 Page:157-161
ISSN:0022-0248
Container-title:Journal of Crystal Growth
language:en
Short-container-title:Journal of Crystal Growth

Author:

Hu Jianzheng,Yang Lianqiao,Hwang Woong Joon,Shin Moo Whan

Publisher

Elsevier BV

Subject

Materials Chemistry,Inorganic Chemistry,Condensed Matter Physics

Reference12 articles.

1. Microelectronics Packing Handbook;Jeannotte,1989

2. Thermally induced IC package cracking

3. V. Gektin, A. Bar-Cohen, in: Proceedings of the ITHERM V, InterSoc. Conf. Therm. Phen. El. Syst., Orlando, FL, 1996, pp. 306–313.

4. R. Schmidt, P. Alpern, K. Plecher, R. Tilgner, in: Proceedings of IEEE Electron, Packaging Technology Conference, 1998, pp. 349–353.

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