Funder
National Science Foundation of China
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference30 articles.
1. Recent advances on electromigration in very-large-scale-integration of interconnects;Tu;J Appl Phys,2003
2. Effects of electric and mechanical loads on the morphological evolution of a void in piezoelectric films;Liu;Appl Math Model,2011
3. Micro texture dependence of the mechanical and electrical reliability of electroplated copper thin film interconnections;Murata;Proc-Electr Comp Tech Conf,2011
4. Reliability of thin-film structures for device technologies: adhesion, new material and length scale challenges;Guyer;Proc-Electrochem Soc,2003
5. A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion;Xia;J Mech Phys Solids,1997
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献