A flow cell-based electrochemical system and isotherm-based linear interpolation for the determination of additive concentrations in Cu-Plating baths-Reference-Cited by-同舟云学术

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A flow cell-based electrochemical system and isotherm-based linear interpolation for the determination of additive concentrations in Cu-Plating baths

Published:2023-10 Issue: Volume:947 Page:117794
ISSN:1572-6657
Container-title:Journal of Electroanalytical Chemistry
language:en
Short-container-title:Journal of Electroanalytical Chemistry

Author:

Jung Park Da,Lee Joo-Yul,Choe Seunghoe^ORCID

Funder

Korea Evaluation Institute of Industrial Technology

National Research Foundation of Korea

Ministry of Trade, Industry and Energy

Ministry of Science, ICT and Future Planning

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering,Analytical Chemistry

Reference41 articles.

1. Simulation of copper electrodeposition in through-hole vias;Braun;J. Electrochem. Soc.,2019

2. Chain length variation to probe the mechanism of accelerator additives in copper electrodeposition;Schmitt;PCCP,2019

3. Microfluidic device for in situ observation of bottom-up copper electrodeposition in a TSV-Like structure;Akita;J. Electrochem. Soc.,2020

4. Quaternary ammonium-based levelers for high-speed microvia filling via Cu electrodeposition;Lee;Electrochim. Acta,2022

5. Superconformal film growth: from smoothing surfaces to interconnect technology;Moffat;Acc. Chem. Res.,2023

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