Surface termination and hydrogen bubble adhesion on Si(100) surfaces during anisotropic dissolution in aqueous KOH-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Surface termination and hydrogen bubble adhesion on Si(100) surfaces during anisotropic dissolution in aqueous KOH

Published:2006-11 Issue:1 Volume:597 Page:1-12
ISSN:1572-6657
Container-title:Journal of Electroanalytical Chemistry
language:en
Short-container-title:Journal of Electroanalytical Chemistry

Author:

Haiss Wolfgang,Raisch Philipp,Bitsch Lennart,Nichols Richard J.,Xia Xinghua,Kelly John J.,Schiffrin David J.

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering,Analytical Chemistry

Reference52 articles.

1. Anisotropic Etching of Silicon

2. Silicon Micromachining;Elwenspoekm,1999

3. Etch Stop Techniques for Micromachining

4. A new contactless electrochemical etch-stop based on a gold/silicon/TMAH galvanic cell

5. All-silicon plate wave oscillator system for sensors

Cited by 37 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A New Silicon Mold Process for Polydimethylsiloxane Microchannels;Micromachines;2024-06-29

2. Inhibition of Corrosion in Alkaline Silicon–Air Batteries with Polyethylene Glycol;Advanced Energy and Sustainability Research;2023-09-21

3. A novel and reliable approach for controlling silicon membrane thickness with smooth surface;Microelectronic Engineering;2022-01

4. Alkaline Texturing;Photovoltaic Manufacturing;2021-08-12

5. Anisotropic wet etching of a novel micro-texture structure for an Al/n-Si/Al metal–semiconductor–metal photodetector fabrication;Journal of Micromechanics and Microengineering;2021-07-09

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3