Funder
Knowledge Economy Technology Innovation
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites
Reference25 articles.
1. Three-dimensional molded interconnect devices (3D-MID);Franke,2014
2. Three-dimensional automatic routing for the design of moulded interconnect devices;Zhuo;Int J Comput Integr Manuf,2011
3. 3-D interconnects offer sizeable market opportunity;Mapleston;Mod Plast,1999
4. Process chains for the manufacturing of molded interconnect devices;Islam;Int J Adv Manuf Technol,2009
Cited by
63 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献