1. Islam A, Hansen HN, Tang PT, Kjær EM (2006) Bond strength of two-component injection moulded MIDs. In: Proc. 7th international conference on Moulded Interconnect Devices, September, pp 245–254
2. Hansen HN, Tang PT, Islam A, Tosello G (2007) Selected process chanis for manufacturing of moulded interconnect devices. In: 7th EUSPEN conference
3. Heininger N, Wolfgang J, Jürgen H (2004) Manufacturing of molded interconnect devices from prototyping to mass production with laser direct structuring. In: International Congress MID 2004
4. Krautheim T, Pohlau F, Lorenz W, Meier R (2002) Manual for user and manufacturer 3D MID. Research association moulded interconnect devices 3-D MID e.V. 2nd edition June
5. Islam A (2008) Two component micro injection moulding for moulded interconnect devices. Ph.D. thesis, Department of Mechanical Engineering, Technical University of Denmark, February, ISBN no- 978-87-89502-75-5