Grain structure modification of Cu-Sn IMCs by applying Cu-Zn UBM on transient liquid-phase bonding in novel 3D-IC technologies
Author:
Funder
MOST, Taiwan
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials,General Chemistry
Reference30 articles.
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4. Enhancing mechanical properties via the dual effect of Ni addition and temperature gradient for 5 μm Cu/Sn-3.0Ag-0.5Cu/Cu transient liquid phase bonding;Materials Science and Engineering: A;2023-04
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